 Custom Laser and Die-Cut Solutions for Electronic Applications - Leverage our experience in single and multi-layer die and laser cut parts for electric and electronic products and components including: EMI/RFI Shielding, Conductive Materials, Thermal Dissipating and Static Shielding applications, Custom Multi-Part Assemblies, Enclosure Gaskets, Gap Pads Spacers and Insulators. We stock the following materials frequently used in electronics part applications: Mylar (Polyester), Fishpaper (Vulcanized Fiber) Phenolic, Lexan, Berquist, Formex, Nomex and Kapton.
- EMI/RFI Shielding
- Conductive Materials
- Thermal Dissipating
- Static Shielding
- Custom Multi-Part Assemblies
- Enclosure Gaskets
- Gap Pads
- Spacers and Insulators
| |
